Gold Plating PCB

PCBs surface treated with immersion gold and gold plating have strong oxidation resistance and conductivity. They’re slightly better than the surface treatment of immersion tin we mentioned earlier. In order to plate a gold layer on the PCB, we can adopt two processes, immersion gold and gold plating. Many people think these two processes are the same, but they are not. There are big differences between them. 　Immersion gold: Immersion gold is also known as ENIG. It adopts the method of chemical deposition, which is to generate a plating by chemical redox reaction. And it is also a way to reach a thicker layer of chemical nickel gold Gold plating: Gold plating is flash gold. There are soft gold and hard gold, and generally hard gold is used for gold fingers. The principle is to dissolve nickel and gold (commonly known as gold salt) in a chemical solution, immerse the PCB in the electroplating cylinder and switch on the current a nickel-gold plating on the copper foil of the PCB.
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